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Data collection, packaging and transmission block

-Input power: +5V DC, +12V DC
-Input signal: Pulse signal, CMOS, amplitude level 0 ÷ 5V
-Output signal: Pulse signal, CMOS, amplitude level 0 ÷ 5V
-Input and output data: using TCP/IP protocol, communication via LAN at 1 Gbps speed and SFP+ fiber optic cable at 10 Gbps
-Communication support: IIC, USB, UART
-Processor chip: Virtex 6 FPGAs or equivalent, supporting LAN communication at speeds of 10-100-1000 Mbps Ethernet. SFP+ support ensures data transmission up to 10Gbps. I/O can be expanded with FPGA Mezzanine Card (FMC) HPC and LPC communication standards
-Operating temperature: -45 ÷ 85 °C
-The circuit boards are coated with conformal, anti-oxidation
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